Premier Manufacturer
Connectors are vital components in electronic systems, ensuring reliable signals and power transmission across various applications, from consumer electronics to aerospace. Connectors undergo rigorous testing based on standardized procedures to guarantee their performance and longevity. This article delves into essential connector testing methodologies, referencing the latest revisions of pertinent standards.
Introduction
Ensuring the reliability of connectors is paramount in electronic design. Standardized testing procedures, such as those outlined in the EIA-364 series, provide a framework for evaluating connector performance under various conditions. Adhering to these standards helps manufacturers and engineers maintain consistency and quality in their products.
Electrical Performance Tests
Electrical tests assess connectors’ ability to transmit signals and power without significant loss or interference.
Low-Level Contact Resistance (LLCR) Test
Purpose:
Measures the electrical resistance at the mated contact interface to ensure minimal signal loss.
Test Method:
- Standard Reference: EIA-364-23
- Procedure: A low voltage (typically 20 mV) and current (around 100 mA) are applied to the mated contacts. The resulting voltage drop is measured to calculate the contact resistance.
Acceptance Criteria:
Contact resistance values should align with the connector’s design specifications, typically in the range of a few milliohms.
Dielectric Withstanding Voltage (DWV) Test
Purpose:
Evaluates the connector’s ability to withstand specified voltage levels without breakdown.
Test Method:
- Standard Reference: EIA-364-20
- Procedure: A high voltage is applied between the connector’s contacts and/or between contacts and the shell for a specified duration. The connector should not exhibit dielectric breakdown or excessive leakage current.
Acceptance Criteria:
The connector must withstand the applied voltage without insulation failure, adhering to the specified leakage current limits.
Insulation Resistance Test
Purpose:
Assesses the resistance of the insulating materials between contacts to prevent unintended current flow.
Test Method:
- Standard Reference: EIA-364-21
- Procedure: A DC voltage is applied between isolated contacts, and the resulting leakage current is measured to determine insulation resistance.
Acceptance Criteria:
Insulation resistance should meet or exceed the minimum values specified for the connector, often hundreds to thousands of megohms.
Temperature Rise Versus Current Test
Purpose:
Determines the connector’s ability to carry current without excessive temperature increase.
Test Method:
- Standard Reference: EIA-364-70
- Procedure: Current is applied to the connector, and the temperature rise is monitored until thermal equilibrium is reached.
Acceptance Criteria:
The temperature rise should not exceed the connector’s specified limits, ensuring safe operation under load.
Mechanical Performance Tests
Mechanical tests evaluate connectors’ physical robustness and durability during mating cycles and operational stresses.
Mating and Unmating Force Test
Purpose:
Measures the forces required to engage and disengage the connector, ensuring user-friendly operation.
Test Method:
- Standard Reference: EIA-364-13
- Procedure: The connector is mated and unmated at a controlled rate, and the forces are recorded.
Acceptance Criteria:
The troops should fall within the specified range to ensure ease of use without compromising contact integrity.
Durability Test
Purpose:
Assesses the connector’s ability to withstand repeated mating and unmating cycles without performance degradation.
Test Method:
- Standard Reference: EIA-364-09
- Procedure: The connector undergoes several mating/unmating cycles, followed by performance evaluations.
Acceptance Criteria:
Post-test evaluations should show no significant wear or damage, and electrical performance should remain within specified limits.
Environmental Performance Tests
Environmental tests simulate real-world conditions to ensure that connectors maintain performance under various environmental stresses.
Thermal Shock Test
Purpose:
Evaluates the connector’s resilience to rapid temperature changes.
Test Method:
- Standard Reference: EIA-364-32
- Procedure: The connector is subjected to alternating high and low temperature extremes for several cycles.
Acceptance Criteria:
The connector should exhibit no physical damage, and electrical performance should remain within specified parameters.
Humidity Test
Purpose:
Assesses the connector’s performance under high humidity conditions.
Test Method:
- Standard Reference: EIA-364-31
- Procedure: The connector is exposed to a controlled humid environment, typically at 90-95% relative humidity and a temperature of 40°C (104°F), for a specified duration, often 96 hours or more.
Acceptance Criteria:
Post-test evaluations should reveal no evidence of physical degradation such as corrosion or insulation breakdown, and the connector should meet all specified electrical performance requirements.
Conclusion
Comprehensive testing of connectors, encompassing electrical, mechanical, and environmental assessments, is vital to ensure their reliability and performance in diverse applications. Adhering to standardized test procedures, such as those outlined in the EIA-364 series, provides a consistent framework for evaluating connector quality. By understanding and implementing these testing methodologies, manufacturers and engineers can enhance product reliability, ensure compliance with industry standards, and meet the demanding requirements of modern electronic systems.
Apple Liu is Romtronic’s Marketing Manager, focusing on business growth across the Asian market. With a background in International English and eight years of sales experience in the electronic cable and harness industry, she brings both in-depth industry knowledge and a global outlook to her role.
In addition to leading market strategy, Apple also oversees content development and editorial work—crafting clear, engaging messaging that reflects Romtronic’s values and technical strengths. She is passionate about digital engineering and is committed to strengthening Romtronic’s brand presence and innovation in a competitive global landscape.
